High Precision Wafer Dicing Positioning Vision Solution | CKVision APP Secondary Development Vision System

1. Project Requirements

Precision Parameters

1. Wafer circuit width: 0.005mm, cutting blade width: 0.003mm
2. Vision positioning accuracy for cutting: ±0.001mm
3. Post-cut kerf inspection tolerance: ±0.0005mm

Host Software Integration Requirements

1. Real-time dual-camera image display on host software, auto image saving to designated folders;
2. Auxiliary auto-focus for both imaging systems;
3. Image calculation via low-magnification telecentric camera to guide platform horizontal correction;
4. Fit cutting centerline from high-magnification images, calculate deviation from horizontal reference boundary;
5. Inspect cut kerf to judge whether lines exceed tolerance range;
6. Multi-spec wafer template learning & storage, one-click template loading for product switching;
7. Auto extract centerline coordinates, mark upper/lower boundaries on images for cutting guidance.

2. CKVision Overall Solution

2.1 Hardware Standards

1. Motion Mechanism: Platform flatness & motor positioning accuracy shall be better than 1/2 of overall machine tolerance; ultra-low mechanical jitter to guarantee micron-level positioning; clarify production CT cycle for camera model selection.
2. Dual-Camera Hierarchical Positioning: Camera 1 for rough positioning, Camera 2 for precise positioning; capture images at left & right positions to fit reference lines, output coordinates & rotation angle to guide cutting. Horizontal & vertical cutting only require 90° tray rotation to reuse positioning logic.
3. Camera Recommendation: Global shutter small-format industrial cameras, high-speed trigger for on-the-fly capture, short focal lens to ensure sufficient depth of field.

2.2 Secondary Development via OCX Control(CKVision APP)

1. One-click control registration via batch script, complete Demo project provided;
   

   

2. 9-point calibration algorithm with Mark point to convert pixel coordinates to physical mechanical coordinates;
3. Coordinate linkage: Vision reads mechanical coordinates at image capture moment to calculate actual wafer position;
4. Dual-line fitting positioning: Capture images at left/right FOV, fit two reference lines to generate center baseline & rotation compensation angle.

3. Core Vision Function Introduction

3.1 CKVision APP Control Integration Steps

1. Run CKVisionReg.bat with administrator privileges to register control;
2. Tick CKVisionCtrl Control in VS Toolbox COM components, drag to form for quick integration;
3. Built-in functions: view zoom, view lock, project configuration loading, ready for direct invocation.

3.2 Core Image Algorithms

1. Multi-point line fitting: Collect dozens of edge scan points to fit upper/lower cutting boundaries, output center coordinates & tilt angle accurately;
2. Image preprocessing: Filter denoising, gradient threshold adjustment to eliminate wafer texture interference for clear, stable edges;
3. Shape template matching: Output matching X/Y coordinates & rotation angle to motion platform for automatic correction;
4. Kerf deviation inspection: Compare with standard centerline, auto trigger NG signal when kerf exceeds tolerance.

3.3 Full Equipment Workflow

1. Rough Positioning: Camera 1 captures left & right images, fits reference lines, calculates wafer center & rotation angle for tray auto correction;
2. Precise Positioning: High-magnification camera re-captures dual-side images to fit ultra-precise centerline;
3. Cutting Execution: Vision transmits coordinate data to blade for cutting; horizontal/vertical switching only needs 90° tray rotation.

4. Matching Requirements for Host & Mechanism

1. Stable imaging with clear edge separation; image fluctuation ≤ 1/3 of vision tolerance;
2. Extremely low mechanical vibration to avoid micron-level positioning offset;
3. Global shutter high-speed camera to support on-the-fly capture and production cycle demands.

5. Full Technical Support Service

1. Free sample lighting test & professional vision solution report;
2. On-site software demonstration, hardware model matching & selection;
3. Graphic programming training for client engineers;
4. Full assistance for host software joint debugging & stable mass production launch;
5. Emergency on-site technical support.

6. Solution Advantages

1. Independently developed CKVision algorithm, complete IP rights including software copyrights & invention patents;
2. Lightweight CKVision APP control, drastically shorten host software development cycle without complex vision coding;
3. Hierarchical rough & precise positioning architecture, achieve ±0.001mm ultra-high accuracy for strict semiconductor wafer processes;
4. Multi-protocol communication support: TCP/IP, IO, RS232, compatible with PLC, motion controllers & robots;
5. Multi-spec wafer template storage, quick product switching for flexible production lines.